The working principle of heat pipe radiator in electronic radiator
The working principle of the heat pipe radiator in the electronic radiator, the heat pipe is a heat transfer element with high thermal conductivity:
1944: R.S. Gaugler of General Motors first proposed the working principle of heat pipes, but his idea was not widely adopted at the time;
1963: G.M. Grover of the Los Alamos laboratory in the United States reinvented this heat transfer element independently, conducted performance tests, and named it heat pipe;
1965: Cotter first proposed a more complete thermal management theory;
After 1970: the rapid development of heat pipe technology, my country has also begun to conduct research and application of heat pipe technology;
After 1985: Due to the rapid development of the IC industry according to Moore's Law, the development of heat dissipation technology, especially the great development of heat pipe technology, enables large-scale production and low cost. The use of heat pipe technology can be used for many old-fashioned radiators or heat exchange products. and major improvements to the system. The thermal resistance of a heat sink is determined by the thermal conductivity of the material and the effective area within the volume. When the volume of the solid aluminum or copper radiator reaches 0.006m3, the thermal resistance cannot be significantly reduced by increasing its volume and area. For discrete semiconductor devices with double-sided heat dissipation, the thermal resistance of an air-cooled all-copper or all-aluminum heat sink can only reach 0.04°C/W. The heat pipe radiator can reach 0.01℃/W. Under natural convection cooling conditions, heat pipe radiators can perform more than ten times better than solid radiators.