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Conditions for high-power heat dissipation of electronic radiators
2022-03-05 15:51:50

      Conditions for high-power heat dissipation of electronic radiators

      First of all, determine the electronic components to be dissipated, and clarify their working parameters, working conditions, dimensions, and installation methods. The size of the bottom plate of the radiator should be slightly larger than the component mounting surface. Because of the limitation of installation space, the radiator mainly relies on Convection with air to dissipate heat, and the heat dissipation effect of the radiator beyond the contact surface with the component decreases with the increase of the distance from the component. For single-rib radiators, if the required width of the radiator can be truncated with a radiator that is twice or three times the width.

      The characteristic of the radiator of the shovel tooth process is that the tooth piece and the bottom are integrally formed, which reduces the risk of excessive thermal resistance of other media between the tooth piece and the bottom plate compared with the traditional tooth shaping or gluing process. The high ratio tooth layout can not only ensure that the product has enough heat dissipation surface area, but also ensure the air flow between the teeth, so that the system air duct can flow through each tooth gap. Even without a system fan, a good heat radiation channel can be ensured, which is conducive to the flow of heat.


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